Wireless
Proven leader in IoT silicon and software for all major ecosystems.
Developing connected products isn’t easy. Timelines are tight. Embedded security skills and technology are scarce. Reuse of hardware and software is a challenge. And finding a truly robust, integrated solution is tough. We’re here to help.
As the proven, leading supplier for all major IoT ecosystems, Silicon Labs has deployed more than one billion wireless chips for the Internet of Things. We have the silicon, software and tools for speedy development of smart home, commercial, consumer and industrial applications.
With our scalable, and securely upgradeable architecture for end nodes and gateways, we make it possible to meet stringent government regulations and secure your connected product throughout its lifecycle. Take advantage of our expertise in mesh technology and multiprotocol coexistence to deliver advanced, secure wireless solutions for the IoT.
Ready to get started? Let's build a smarter, more secure, connected world together. Pick your protocol.
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| Maturity | Est. 2017 | Est. 2010 | Varies depending on customer | Est. 2015 | Est. 1997 | Est. 2011 | Est. 2003 | Est. 2003 |
| Topology Support |
Managed Mesh flooding | Point-to-point Star Broadcast |
Subject to protocol design | Mesh routing with border routers |
Star Point-to-point |
Self-healing mesh | Mesh routing | Mesh Star |
| Native IP Addressing |
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Varies on protocol | ✔ | ✔ | ✔ | ✖
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| Xpress | ✖
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✔ | ✖
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✔ | ✖
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| Multiprotocol |
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Zigbee Proprietary |
Bluetooth | Bluetooth Zigbee |
Bluetooth Thread |
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| Featured Product |
EFR32BG21 | EFR32BG22 | EFR32FG22 | EFR32MG21 | WFM200 | EFR32FG12 | EFR32MG22 | ZGM130S |
On-Demand
Your Connection to All Things IoT
Access the best tech, tools, and trainers on security, intelligence and ecosystems to advance IoT innovation.
Bluetooth
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Technologies SupportedBluetooth Mesh and Bluetooth 5.2
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Link Budget124 dB
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FlashUp to 1024 kB
Our leading Bluetooth solutions include the latest Bluetooth Low Energy (LE) and Bluetooth Mesh standards for a variety of applications, from smart home to smart industry. We offer an extensive range of SoCs, modules and software tools designed for ease of use. We developed the world's smallest Bluetooth System in Package (SiP) module, enabling you to add Bluetooth to designs quickly while meeting all regulatory certifications.
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Multiprotocol
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Integrated CoreARM Cortex-M33 MCU
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FlashUp to 1024 kB
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RAMUp to 256 kB
Our multiprotocol solutions are designed for the simple implementation of multiple protocols on a single chip. Multiprotocol connectivity provides the ability to run two or more protocols in the same devices on multiple frequency bands.
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Proprietary
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MCU CoreARM Cortex-M33
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FlashUp to 1024 kB
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RAMUp to 256 kB
Our proprietary wireless products provide maximum flexibility for developers looking to implement distinct wireless capabilities or features in their applications. Our extensive portfolio of transceivers, ICs, MCPs and state of the art SoCs, provides high-performance wireless connectivity with ultra-low power consumption. Our proprietary products provide compatibility to legacy protocols, sub-GHz long-range connectivity and application optimized solutions not covered by industry standards for a variety of devices.
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Thread
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RAMUp to 256 kB
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FlashUp to 1024 kB
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Output Power RangeUp to 19 dBm
Thread solves the challenges of IP connectivity from the edge to the cloud, by leveraging self-healing mesh features, native IPv6 based connectivity and state of the art security with a multitude of application-layer choices for connected devices. As a founding board member of the Thread Group, we help accelerate time-to-market with proven mesh networking hardware and certified software solutions using the popular OpenThread open-source implementation.
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Wi-Fi
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Temperature RangeUp to 105 ºC
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Associated DTIM3 Current< 300 μA
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FlashUp to 2048 kB
Our Wi-Fi solutions address the challenge of providing secure IP and cloud connectivity on existing networks. With built-in advanced security features, our low-power IC and certified modules are designed to extend battery life for a wide variety of applications.
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Wi-SUN
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ComprehensiveCertified Hardware, Stack & Tools
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SecurePublic Key Infrastructure
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ScalableIPv6, 6LoWPAN Mesh
Wireless Smart Ubiquitous Network (Wi-SUN) is the leading IPv6 sub-GHz mesh technology for smart city and smart utility applications. Wi-SUN brings Smart Ubiquitous Networks to service providers, utilities, municipalities/local government, and other enterprises, by enabling interoperable, multi-service, and secure wireless mesh networks. Built to scale with long-range capabilities, high-data throughput and IPv6 support, Wi-SUN simplifies wireless infrastructure for industrial applications and the evolution of smart cities.
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Xpress
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Get Started QuicklyNo Programming
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Speed Design TimeFast Time-to-Market
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ProtocolsBluetooth 5 and Wi-Fi
Xpress helps IoT developers who require Bluetooth 5 or Wi-Fi connectivity but need accelerated development and a quicker time-to-market. Our Xpress solutions simplify design through high level embedded, mobile, and hardware abstraction.
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Z-Wave
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Temperature RangeUp to 85 ºC
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Battery Life on Coin CellUp to 10 years
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Long RangeUp to 1 mile
Z-Wave helps IoT product developers create smart home, hospitality and MDU solutions by leveraging an easy-to-use, secure and interoperable ecosystem of products. Designed to maintain interoperability, Z-Wave is backward compatible, regardless of product type, brand, manufacturer or version of the Z-Wave protocol stack. Our solutions provide industry-leading S2 security capabilities and major improvements in energy efficiency, allowing a sensor to last 10 years on a coin-cell battery.
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Zigbee
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Integrated, CompleteFeature-Rich
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Participate in allZigbee Ecosystems
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Enhanced SecurityZigbee 3.0
We are the vendor of choice for IoT innovators developing Zigbee networking into their smart home and connected building ecosystems. We offer the largest deployed, most integrated, complete and feature-rich Zigbee solution available — the industry’s broadest family of Zigbee and multiprotocol wireless SoCs and modules, easing development for OEMs.
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